IoT developers, makers and enterprises will be excited to know that Arduino has unveiled two new “MKR” form-factor IoT boards focused on applications like environmental monitoring, tracking, agriculture, energy monitoring and home automation. A new update from Cypress is a new Wi-Fi and Bluetooth combo solution promising to make long battery life with Wi-Fi a realily for portable and battery-powered IoT devices. Finally, ON Semiconductor’s new 7 mm x 9 mm x 1 mm RF SiP transceiver is meeting the demand of challenging IoT applications where connectivity is needed close to a sensor.

Two New Arduino Boards Give LoRa and 2G/3G Connectivity In IoT

Two newly designed Arduino boards help IoT developers to quickly add LoRa and GSM connectivity to their IoT projects. The new boards come in a MKR form-factor of 67.64 x 25mm and also offer low power consumption, making them useful for applications such as environmental monitoring, tracking, agriculture, energy monitoring and home automation. The Arduino MKR WAN 1300 delivers LoRa connectivity via a Murata LoRa module, and the MKR GSM 1400 adds global 2G and 3G communications through an integrated u-blox module. Both boards use the Atmel SAM D21 microcontroller, featuring a 32-bit ARM Cortex-M0+ processor, 256KB Flash memory and 32KB SRAM. Read more.

Wi-Fi & Bluetooth Combo Reduces Power Consumption For Wearables

A new combo solution from Cypress brings ultra-low-power WiFi and Bluetooth connectivity to a wide range of IoT systems needing extended battery life, from wearables to smart home products. Supporting Wi-Fi 802.11ac and Bluetooth 5.0, the new CYW43012 chip is manufactured using a 28nm process technology, which claims to reduce energy consumption in comparison with the solutions currently available, in the reception mode by 70% and in sleep mode by 80%. The chip is supported by Cypress WICED Studio development environment to ease integration into IoT projects. Read more.


Compact Sigfox Device For Low power IoT/IIoT

On Semi is helping developers meet the challenging space constraints of many IoT applications with its new Sigfox RC1 verified SiP (System in Package) transceiver. The new programmable device integrates an advanced RF SoC with all surrounding Bill of Material (including a TCXO). The AX-SIP-SFEU, the company says, provides the most integrated Sigfox solution for both uplink (transmit) and downlink (receive) communications. The 7 x 9 x 1 mm device is said to have almost one-third the footprint and is one-tenth the overall size of a module-based solution, giving engineers much greater design freedom. Read more.



Upasana Dewan


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