A multinational fabless semiconductor manufacturer, MediaTek Incorporated (TWSE: 2454), powers nearly 2 billion connected devices annually. Innovating systems-on-chip (SoC) for mobile, home entertainment, networking, and Internet of Things (IoT) products, we are a market leader.
MediaTek today unveiled the octa-core Genio 700, the newest chipset in the Genio platform for Internet of Things devices, ahead of CES 2023. This chip is intended for smart home, smart retail, and industrial IoT products. At CES 2023, a demo of the new chipset will be presented at the MediaTek booth.
The MediaTek Genio 700 is an N6 (6nm) IoT chipset with a focus on power economy. It has two ARM A78 cores running at 2.2GHz and six ARM A55 cores at 2.0GHz, as well as a 4.0 TOPs AI accelerator. It includes an ISP for improved images as well as support for FHD60+4K60 displays.
Designers can alter goods using Yocto Linux, Ubuntu, and Android thanks to the Genio 700 SDK. Regardless of the type of application, users can easily and quickly construct their own products with this help.
The MediaTek Genio 700 also has the following additional features:
- Supports high-speed interfaces such PCIe 2.0, USB 3.2 Gen1, and MIPI-CSI for cameras.
- Supports dual displays with FHD60+4K60 resolutions and AV1, VP9, H.265 and H.264 (video decoding).
- Support for a wide temperature range and industrial-grade design with a 10-year lifespan.
- ARM SystemReady certification for standardising and simplifying platform integration; – ARM PSA certification for heightened security.
“When we launched the Genio family of IoT products last year, we designed the platform with the scalability and development support that brands need, paving the way for opportunities to continue expanding,” said Richard Lu, Vice President of MediaTek IoT Business Unit. “With a focus on industrial and smart home products, the Genio 700 is a perfect natural addition to the lineup to ensure we can provide the widest range of support possible to our customers.”