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Sony Announces A New IoT Connectivity Platform

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The debut of the ALT1350 for the international market has been announced by Sony Semiconductor Israel (Sony), a manufacturer of cellular IoT chipsets.

The ALT1350 is the first cellular LTE-M/NB-IoT solution in the history of the world to integrate satellite connectivity (NTN), additional LPWA communication protocols, and LTE-M/NB-IoT in a single chipset, paving the way for further advancement in the linked world.

One cellular IoT solution available right now is Sony’s ALT1350, which has an architecture that allays the concerns of IoT service providers about power consumption. While compared to the current generation, its optimised standby mode (eDRX) cuts power consumption by 80%, and when using it to send brief messages, it cuts power consumption by 85%.

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The integrated sub-GHz and 2.4GHz transceiver of the ALT1350 offers hybrid connectivity for trackers, smart cities, smart metres, and other gadgets. Using IEEE 802.15.4-based protocols, such as Wi-Sun, U-Bus Air, and wM-Bus, in additional point-to-point and mesh technologies improves coverage, lowers prices, and further lowers power consumption.

The ALT1350 contains a sensor hub to gather data from the sensors while still consuming extremely little power. Additionally, it offers location based on cellular and Wi-Fi networks and is tightly integrated to offer concurrent LTE and GNSS that is power-optimized in order to support a variety of demanding tracking applications on a single chip.

The chipset is made to accommodate the diverse market requirements of transportation, monitoring technology, smart cities, connected health, and other verticals. Its low power consumption, long battery life, robust Release 15 LTE-M/NB-IoT software stack, and potential interoperability with 3GPP release 17 will be utilised by device manufacturers across various industries. All of features ensure durability and guarantee that the ALT1350 will work with 5G networks. It also has a second LPWA radio transceiver that operates in the 2.4 and 1GHz ISM bands enabling a variety of connectivity choices.

The chipset offers on-the-edge low-power computing capabilities, including data collecting, low-power AI/ML processing, and MCU to enable IoT applications on the chip. The device will go on sale in 2023 and is currently being sampled to attract buyers.

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