- Based on the new Qualcomm® 9205 LTE modem and features the optional 2G alternative.
- The modules also provide a foundation for the future of IoT deployments that span legacy networks like 4G and 5G.
- These versions also support GSM voice and will support VoLTE for applications that require the ability to make phone calls.
For mass-scale LTE-M and NB-IoT deployments to incorporate millions of devices and meet the booming global demand of devices for applications such as wearable medical devices, fitness trackers, industrial sensors, smart metering and home automation, Telit, a global enabler of the Internet of Things (IoT), has announced the release of ME310G1 and ME910G1 modules.
About the products
The highly compact chipsets ME310G1 and ME910G1 are the first 3GPP Releases with 14 additions to the Telit portfolio. The first members of Telit’s new series based on the Qualcomm 9205 LTE IoT Modem was announced in late 2018.
These new modules are ideal for battery-powered applications via improved features such as Power Saving Mode (PSM) and extended Discontinuous Reception (eDRX), which periodically wakes up the device to transmit only the smallest amounts of data necessary before returning to sleep mode.
Exciting features
Both modules ensure reliable indoor connections, with a maximum coupling loss of up to +15dB/+20dB for superior in-building penetration as compared to the earlier LTE standards.
The ME910G1 is replacable in existing devices for 2G, 3G and the various categories of LTE. With this, developers can cut costs and development time by simply designing for the xE910 LGA common form factor. This gives them the freedom to deploy technologies best suited for an application’s environment.
The ME310G1 LTE is less than 200 mm2 while its variant with 2G replacability is less than 300mm2. This enables enterprises to deploy new small footprint designs and benefit from low-power and low-data rate capabilities. The xE310 family’s flexible perimeter footprint includes pin-to-pin compatible 2G and 4G modules, enabling integrators to design a single PCB layout and deploy a combination of technologies.
Manish Watwani, chief marketing and product officer, Telit, said that with the new ME310G1 and ME910G1, IoT developers, providers and their customers can now take advantage of the latest and greatest technologies.
He also added that the ME310G1 is extremely optimized in size, and both the ME310G1 and ME910G1 are highly optimized for affordability, power efficiency, performance, and future-proofing, making them the ideal foundation for mass-scale IoT deployments that need to remain in service for a decade or longer.
Vice president, business development, Qualcomm Technologies, Inc., Jeffery Torrance stated that the modules provide cutting-edge connectivity and compute technologies enable a massive volume for range of connected devices.
