STMicroelectronics to Launch a Flexible IoT Plug and Play Module

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For experienced designers, SensorTile.box offers developer and expert modes that can help in creating sophisticated applications

STMicroelectronics, a global leader in semiconductors, announced that it is launching SensorTile.box, a flexible Internet of Things (IoT) plug and play module that can help a range of customers from young people to expert designers and beginners to IoT professionals, in discovering the power of IoT. In addition, they can quickly understand how easily sensor information can be collected and sent to the cloud.

The new module can be easily connected with Bluetooth Low Energy (BLE) to a smartphone, enabling users to watch the sensors function as a pedometer, environmental monitor, asset tracker or as other instruments.

For experienced designers, SensorTile.box offers developer and expert modes that can help in creating sophisticated applications by utilising a graphical wizard or by writing custom embedded code.

SensorTile.box will be displayed as a latest demonstration platform for Azure IoT Central that simplifies connecting smart devices to cloud for data capture and analysis.

Suitable for users of any skill level

Speaking on the development, Andrea Onetti, General Manager – MEMS Sensor Division, STMicroelectronics, said, “SensorTile.box is uniquely flexible. It can be configured for users of any skill level to support learning, prototyping, or even as a module within a commercial end-product.”

“Now IoT Plug and Play certified and compatible with IoT Central, it connects out-of-the-box with Azure IoT to further extend opportunities for learning and new-product development,” Onetti added.

Tony Shakib, Principal Group PM Manager, Microsoft IoT Business Acceleration, Microsoft Corp, said, “SensorTile.box will be showcased as a demonstration platform for Azure IoT Central, which aims to help everyone understand the benefits of IoT and the cloud and show them how easy it is to connect.”

The new module features ST MEMS devices for motion, environmental and context sensing housed in a strong 57mm x 38mm x 20mm IP54 plastic container. The new module is likely to be available from the beginning of June this year.

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