Pepperl+Fuchs Launches Level Sensor for IIoT Applications

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WILSEN.sonic.level is a wireless sensor bundled with ultrasonic module for detecting fill level, both outdoors and in harsh environments

Pepperl+Fuchs, a global company specialises in sensor manufacturing, announced the launch of a level sensor – WILSEN.sonic.level, which is designed to transmit its data to a secure remote location in the industrial Internet of Things (IIoT).

Integrated into a starter package with a business data platform and WILSEN.service, the new IoT sensor allows users to determine the IoT system value for their own organisation.

The WILSEN.service allows exchange of data securely and enables centralised management of all the IoT sensors in the area. This in turn, helps in connecting software systems and data platforms for business data processing to the service.

Applicable for fill level detection

WILSEN.sonic.level is a wireless sensor bundled with ultrasonic module for detecting fill level, both outdoors and in harsh environments. The sensor can be used to monitor fill levels in mobile containers, silos and tanks. Besides, the battery-operated device identifies the geolocation of the container and communicates the gathered data through a built-in GSM chip or low range wide area network (LoRaWAN) connection to a specific collection point on the Internet.

In addition, it can also transmit status information about things such as temperature and battery life. The wireless sensor has a battery life of up to five years.

Pepperl+Fuchs has also assembled an entry-level starter kit that consists of all the components needed to build a working IoT system. This suite enables interested users to start with the IoT, even without having prior knowledge, so that they can gain experience in their own process environment.

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