An ultra-compact, production-ready embedded computing module, Intrinsyc’s Open-Q 660 µSOM is developed to support intelligent, high-performance, on-device processes
Intrinsyc Technologies Corporation, a leading global provider of solutions for production and development of embedded and Internet of Things (IoT) products, has introduced Open-Q 660 µSOM (micro System on Module) and Development Kit.
Powered by the Qualcomm SDA660 system on chip (SoC), the new module is an ideal platform to power the increasing demand for industrial and consumer IoT devices.
An ultra-compact, production-ready embedded computing module, the SOM is developed to support intelligent, high-performance, on-device processes that utilise heterogenous computing capabilities to support a range of high-performance industrial and consumer IoT devices.
Product development support
Speaking on the development, Cliff Morton, Vice President, Solutions Engineering, Intrinsyc, said, “Open-Q 660 µSOM is an ideal platform to power the growing demand for consumer and industrial IoT devices capable of artificial intelligence (AI) and machine learning (ML).”
“To assist with integration of our System on Modules into customer products, Intrinsyc offers strong capabilities in all phases of product development. Services include everything from electrical and mechanical design to software development, including camera and audio tuning, AI, power optimisation, device management, security, and more,” Morton added.
Jeffery Torrance, Vice President – Business Development, Qualcomm Technologies, said, “We are proud to see Intrinsyc’s new micro-SOM product being powered by the Qualcomm SDA660. Qualcomm Technologies is driving the IoT forward with our cutting-edge compute and connectivity technologies, and we are honored to enable a bright future of IoT devices along with Intrinsyc.”
Full-featured development platform
The Open-Q 660 µSOM Development Kit offered by Intrinsyc is a full-featured development platform that include the software tools and accessories needed to immediately start development.
The development kit is integrated with production-ready Open‐Q 660 µSOM with a carrier board offering multiple expansion and connectivity options in order to help the development and testing of a vast variety of peripherals and applications, thus ensuring the fastest time to market.